TOKUYAMA® EE-BOND is a dental adhesive system formulated for the enamel-etching technique. Utilizing Tokuyama's 3D self-reinforcing (SR) monomer, TOKUYAMA® EE-BOND chemically bonds to both enamel and dentin forming a durable 3D matrix bonding layer. This thin but durable bonding layer offers long-term marginal integrity of the esthetic restoration as well as exceptional dentinal sealing.
PRODUCT SUPPORT LINK
INDICATIONS
Bonding of light- or dual-cured composite to:
1. cut/uncut enamel
2. cut/uncut dentin
3. fractured porcelain/composite repair
1. cut/uncut enamel
2. cut/uncut dentin
3. fractured porcelain/composite repair
BENEFITS
- Outstanding adhesion performance
- Dependable marginal integrity (Minimized micro-leakage)
- Reduced post-operative sensitivity
- Perfect cavity sealing
- Less technique sensitivity
- Prolonged working time
- Fluoride releasing
SIMPLE PROCEDURE
DEPENDABLE MARGINAL INTEGRITY
PHYSICAL PROPERTIES
PRODUCT PACKAGES AVAILABLE
TOKUYAMA® EE-BOND Intro Kit
- EE-BOND Bottle / 5mL
- Applicator x 25
- Dispensing well
- TOKUYAMA ETCHING GEL HV Syringe / 2.5mL
- Syringe Tip x 10
